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  aod403/aoi403 30v p-channel mosfet general description product summary v ds i d (at v gs = -20v) - 70a r ds(on) (at v gs = -20v) < 6.2m w (< 6.7m w * ) r ds(on) (at v gs = -10v) < 8m w (< 8.5m w * ) 100% uis tested 100% r g tested symbol v ds v gs v 2 5 gate-source voltage drain-source voltage -30 the aod403/aoi403 uses advanced trench technology to provide excellent r ds(on) , low gate charge and low gate r esistance. with the excellent thermal resistance of the dpak/ipak package, this device is well suited for high current load applications. v maximum units parameter absolute maximum ratings t a =25c unless otherwise noted -30v to252 d pak top view bottom view g s d g s d g d s g g d d s s top view bottom view t o251a ipak v gs i dm i as , i ar e as , e ar t j , t stg symbol t 10s steady-state steady-state r q j c * package to251a t yp max t c =25c 2 .5 45 t c =100c j unction and storage temperature range -55 to 175 c thermal characteristics units maximum junction-to-ambient a c/w r q j a 16 4 1 20 parameter v 2 5 gate-source voltage avalanche energy l=0.1mh c mj a valanche current c -12 a a t a =25c i dsm a t a =70c - 200 pulsed drain current c continuous drain cu rrent g i d -70 - 55 t c =25c t c =100c p ower dissipation b p d continuous drain cu rrent 125 -15 -50 w power dissipation a p dsm w t a =70c 9 0 1.6 t a =25c m aximum junction-to-case c/w c/w maximum junction-to-ambient a d 0.9 50 1.6 rev.9.0: july 2013 www.aosmd.com page 1 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com
aod403/aoi403 symbol min typ max units bv dss -30 v v ds =-30v, v gs =0v -1 t j =55c -5 i gss 100 na v gs(th) gate threshold voltage -1.5 -2.5 -3.5 v i d(on) -200 a 5.1 6.2 t j =125c 7.6 9.2 g fs 42 s v sd -0.7 -1 v i s -70 a c iss 2310 2890 3500 pf c oss 410 585 760 pf c rss 280 470 660 pf r g 1.9 3.8 5.7 w q 40 51 61 nc r ds(on) m w m w 5.6 6.7 6.7 8.5 reverse transfer capacitance maximum body-diode continuous current g input capacitance output capacitance dynamic parameters gate resistance v gs =0v, v ds =0v, f=1mhz total gate charge m w to252 6.2 8 m w v gs =-20v, i d =-20a to251a i dss m a v ds =v gs i d =-250 m a v ds =0v, v gs = 25v zero gate voltage drain current gate-body leakage current v gs =-10v, v ds =-5v v gs =-20v, i d =-20a forward transconductance diode forward voltage v gs =-10v, i d =-20a to252 i s =-1a,v gs =0v v ds =-5v, i d =-20a on state drain current static drain-source on-resistance vgs=-10v, id=-20a to251a v gs =0v, v ds =-15v, f=1mhz switching parameters electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions drain-source breakdown voltage i d =-250 m a, v gs =0v q g 40 51 61 nc q gs 10 12 14 nc q gd 10 16 22 nc t d(on) 16 ns t r 12 ns t d(off) 45 ns t f 22 ns t rr 14 18 22 ns q rr 9 11 13 nc this product has been designed and qualified for the consumer market. applications or uses as critical c omponents in life support devices or systems are not authorized. aos does not assume any liability arising out of such applications or uses of its products. aos reserves the right to improve product design, functions and reliability without notice. body diode reverse recovery charge i f =-20a, di/dt=100a/ m s turn-on delaytime turn-on rise time turn-off fall time total gate charge v gs =-10v, v ds =-15v, i d =-20a gate source charge gate drain charge v gs =-10v, v ds =-15v, r l =0.75 w , r gen =3 w turn-off delaytime i f =-20a, di/dt=100a/ m s body diode reverse recovery time a. the value of r q ja i s measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environment with t a =25 c. the power dissipation p dsm is based on r q ja and the maximum allowed junction temperature of 150 c. the value in any given application depends on the user's specific board design, and the maximum temperature of 175 c may be used if the pcb allows it. b. the power dissipation p d is based on t j(max) =175 c, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. c. repetitive rating, pulse width limited by junction temperature t j(max) =175 c. ratings are based on low frequency and duty cycles to keep initial t j =25 c. d. the r q ja is the sum of the thermal impedence from junction to case r q jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max) =175 c. the soa curve provides a single pulse rating. g. the maximum current rating is package limited. h. these tests are performed with the device mounted on 1 in 2 fr-4 board with 2oz. copper, in a still air environment with t a =25 c. rev.9.0: july 2013 www.aosmd.com page 2 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com
aod403/aoi403 typical electrical and thermal characteristics 17 5 2 10 0 18 0 2 0 40 60 80 100 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 -i d (a) -v gs (volts) fi gure 2: transfer characteristics (note e) 2 4 6 8 1 0 0 5 10 15 20 25 30 r ds(on) (m w w w w ) -i d (a) figure 3: on-resistance vs. drain current and gate voltage (note e) 0.8 1 1 .2 1.4 1.6 1.8 0 25 50 75 100 125 150 175 200 normalized on-resistance temperature (c) figure 4: on-resistance vs. junction temperature (note e) v g s =-10v i d =-20a v g s =-20v i d =-20a 25 c 125 c v ds =-5v v g s =-10v v g s =-20v 0 2 0 40 60 80 100 0 1 2 3 4 5 -i d (a) -v ds (volts) fi g 1: on-region characteristics (note e) v gs =-4v -4.5v - 6v -10v -5v 18 40 gate voltage (note e) 1.0e-05 1 .0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -i s (a) -v sd (volts) figure 6: body-diode characteristics (note e) 25 c 125 c (note e) 0 5 1 0 15 20 0 5 10 15 20 r ds(on) (m w w w w ) -v gs (volts) figure 5: on-resistance vs. gate-source voltage (note e) i d = -20a 25 c 125 c rev.9.0: july 2013 www.aosmd.com page 3 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com
aod403/aoi403 typical electrical and thermal characteristics 0 2 4 6 8 1 0 0 10 20 30 40 50 60 -v gs (volts) q g (nc) figure 7: gate-charge characteristics 0 1 000 2000 3000 4000 5000 0 5 10 15 20 25 30 capacitance (pf) -v ds (volts) fi gure 8: capacitance characteristics c i ss 0 8 0 160 240 320 400 0.0001 0.001 0.01 0.1 1 10 power (w) pulse width (s) figure 10: single pulse power rating junction - to - c o ss c rss v d s =-15v i d =-20a t j( max) =175 c t c =25 c 10 m s 0.0 0 .1 1.0 10.0 100.0 1000.0 0.01 0.1 1 10 100 -i d (amps) -v ds (volts) figure 9: maximum forward biased 10 m s 10ms 1ms dc r d s(on) limited t j( max) =175 c t c =25 c 100 m s 40 figure 10: single pulse power rating junction - to - case (note f) 0.01 0 .1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 z q q q q jc normalized transient thermal resistance pulse width (s) figure 11: normalized maximum transient thermal impedance (note f) single pulse d=t o n /t t j,pk =t c +p dm .z q jc .r q jc t o n t p d in descending order d =0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse figure 9: maximum forward biased safe operating area (note f) r q jc = 1.6 c/w rev.9.0: july 2013 www.aosmd.com page 4 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com
aod403/aoi403 typical electrical and thermal characteristics 0 18 0 3 0 60 90 120 150 0 25 50 75 100 125 150 175 power dissipation (w) t case (c) figure 13: power de-rating (note f) 0 1 0 20 30 40 50 60 70 80 0 25 50 75 100 125 150 175 current rating i d (a) t case ( c) 1 1 0 100 1000 10000 0.00001 0.001 0.1 10 1000 power (w) pulse width (s) figure 15: single pulse power rating junction - to - t a = 25 c 10.0 1 00.0 1000.0 1 10 100 1000 -i ar (a) peak avalanche current time in avalanche, t a (ms) figure 12: single pulse avalanche capability (note c) t a = 25 c t a = 150 c t a = 100 c t a = 125 c 18 40 0.001 0 .01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 z q q q q ja normalized transient thermal resistance pulse width (s) figure 16: normalized maximum transient thermal impedance (note h) single pulse d=t o n /t t j,pk =t a +p dm .z q ja .r q ja t on t p d in descending order d =0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse t case ( c) figure 14: current de-rating (note f) figure 15: single pulse power rating junction - to - ambient (note h) r q ja = 50 c/w rev.9.0: july 2013 www.aosmd.com page 5 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com
aod403/aoi403 vdc ig vds dut vdc vgs vgs qg qgs qgd charge gate charge test circuit & waveform - + - + -10v id vds unclamped inductive switching (uis) test circuit & waveforms vds l 2 e = 1/2 li ar a r vdc dut vdd vgs vds vgs rl rg resistive switching test circuit & waveforms - + vgs vds t t t t t t 90% 1 0% r on d(off) f off d(on) vdd vgs id vgs rg dut vdc vgs id vgs - + bv dss i ar ig vgs - + vdc dut l vgs isd diode recovery test circuit & waveforms vds - vds + di/dt rm rr vdd v dd q = - idt t rr -isd -vds f -i - i rev.9.0: july 2013 www.aosmd.com page 6 of 6 nt?qtu5[pg ?pqls? www.whxpcb.com


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